Flexible display device

ABSTRACT

A flexible display device that can suppress spread of cracks of an inorganic layer is provided. A flexible display device includes a flexible substrate including a display area and a periphery surrounding the display area, an inorganic layer formed on the flexible substrate, a display unit formed on the display area, and a thin film encapsulation layer covering the display unit. The inorganic layer includes an opening disposed on a periphery between edges of the flexible substrate and the thin film encapsulation layer.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to and the benefit of Korean PatentApplication No. 10-2013-0091095 filed in the Korean IntellectualProperty Office on Jul. 31, 2013, the entire contents of which areincorporated herein by reference.

BACKGROUND

1. Field

Example embodiments relate to a flexible display. More particularly,example embodiments relate to a flexible display manufactured byscribing a flexible mother board into predetermined number of panels.

2. Description of the Related Art

A flat panel display includes a substrate and a display unit including aplurality of pixels formed on the substrate. The flat panel display mayhave a bending characteristic when the substrate is formed of a flexiblematerial like a plastic film instead of a rigid material like glass. Theflexible display device may be a liquid crystal display (LCD) or aself-emissive organic light emitting diode (OLED) display.

The flexible display device is manufactured through a process in which aplurality of display units and a plurality of thin film encapsulationlayers are formed on a mother board, an upper protection film and alower protection film are layered in the flexible mother board, and themother board is separated to individual flexible display devices bycutting scribe lines between individual flexible display devices. Theupper protection film, the lower protection film, and the flexiblemother board are cut by putting strong pressure on the mother boardusing a cutting knife.

The strong pressure is applied as an impact to the flexible displaydevice and, at the same time, a bending force is applied to the flexibledisplay device during a cutting process. Thus, inorganic layers (such asa barrier layer, a buffer layer, and various insulating layers) close tothe scribe lines are damaged, thereby causing cracks. The cracksgenerated in the inorganic layer are spread toward a thin filmencapsulation layer during a post-process after the cutting, therebycausing panel shrinkage due to a loss of an encapsulation function ofthe thin film encapsulation layer.

The above information disclosed in this Background section is only forenhancement of understanding of the background of the invention andtherefore it may contain information that does not form a prior art.

SUMMARY

Example embodiments have been made in an effort to provide a flexibledisplay device that can prevent a failure such as panel shrinkage byblocking spread of cracks generated during a cutting process to a thinfilm encapsulation layer.

A flexible display device according to an exemplary embodiment includesa flexible substrate including a display area and a peripherysurrounding the display area, an inorganic layer formed on the flexiblesubstrate, a display unit formed on the display area and a thin filmencapsulation layer covering the display unit. The inorganic layerincludes an opening disposed on a periphery between edges of theflexible substrate and the thin film encapsulation layer.

The opening may extend along the edges of the flexible substrate. Theopening in which a pad area exists may include a plurality of openingpatterns disposed between pad electrodes.

A blocking layer may be formed by filling an organic material in theopening, the organic material comprising at least one of aurethane-based resin, an epoxy-based resin, and an acryl-based resin.

The opening may be formed at about 100 μm to 500 μm from the edges ofthe flexible substrate.

A width of the opening is about 20 μm to about 200 μm.

The opening may include a plurality of openings extending along a seconddirection and substantially parallel to each other.

The opening may include a plurality of openings arranged along a seconddirection that is parallel with the edges of the flexible substrate.

The plurality of openings may be arranged to form at least two rowsarranged along the second direction, and gaps between the openings in afirst row and a second row are not in a same line substantiallyperpendicular to the edges of the flexible substrate.

The gaps between the openings in a first row and a second row may besmaller than a gap between the openings in a first row and the secondrow.

The inorganic layer may include a plurality of openings disposed along asecond direction.

The width of each of the plurality of openings along the seconddirection may be greater than a distance between the plurality ofopenings.

According to the present exemplary embodiment, the opening is formed inthe inorganic layer of the flexible display device so that spread ofcracks toward the thin film encapsulation can be blocked, therebyimproving production yield by suppressing panel shrinkage and displayfailure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a plan view of a flexible display according to a firstexemplary embodiment.

FIG. 2 is a partial cross-sectional view of FIG. 1, taken along the lineII-II.

FIG. 3 is a schematic cross-sectional view provided for description of amanufacturing method of the flexible display.

FIG. 4 is a partially enlarged cross-sectional view of a flexibledisplay according to a second exemplary embodiment.

FIG. 5A is a partially enlarged cross-sectional view of a flexibledisplay according to a third exemplary embodiment.

FIG. 5B is a plan view of FIG. 5A.

FIG. 6A-FIG. 6B is a partial plan view of a flexible display accordingto a fourth exemplary embodiment.

FIG. 7 is a partially enlarged cross-sectional view of a flexibledisplay according to a fifth exemplary embodiment.

DETAILED DESCRIPTION

Embodiments of the inventive concept will be described more fullyhereinafter with reference to the accompanying drawings, in whichexemplary embodiments of the inventive concert are shown. As thoseskilled in the art would realize, the described embodiments may bemodified in various different ways, all without departing from thespirit or scope of the inventive concept.

In the specification, unless explicitly described to the contrary, theword “comprise” and variations such as “comprises” or “comprising” willbe understood to imply the inclusion of stated elements but not theexclusion of any other elements which is not stated. In addition, itwill be understood that when an element such as a layer, film, region,or substrate is referred to as being “on” another element, it can bedirectly on the other element or it may be disposed on the layer, film,region, or substrate with intervening elements. In contrast, when anelement is referred to as being “directly on” another element, there areno intervening elements present. Further, in the specification, the word“on” means positioning on or below the object portion, and does notessentially mean positioning on the upper side of the object portionbased on a gravity direction.

FIG. 1 is a plan view of a flexible display according to a firstexemplary embodiment, and FIG. 2 is a partial cross-sectional view ofFIG. 1 taken along the line II-II.

Referring to FIG. 1 and FIG. 2, a flexible display 100 according to thefirst exemplary embodiment includes a flexible substrate 10, a displayunit 20 formed on the flexible substrate 10, and a thin filmencapsulation layer 30 formed on the display unit 20. The display unit20 is provided with a plurality of pixels PE, and displays an image witha combination of lights emitted from the plurality of pixels PE. Eachpixel PE is formed of a pixel circuit, and a liquid crystal display oran organic light emitting diode 50 of which light emission is controlledby the pixel circuit.

The flexible substrate 10 may be formed of a plastic film such aspolyimide or polycarbonate. However, because the plastic film has ahigher moisture transmission rate and higher oxygen transmittance than aglass which is a typical substrate material for non-flexible display,transmittance of external moisture and oxygen through the flexiblesubstrate 10 should be blocked. Thus, a barrier layer 11 and a bufferlayer 12 may be formed on the flexible substrate 10.

The barrier layer 11 is formed of a plurality of inorganic layers, andfor example, a silicon oxide layer and a silicon nitride layer may bealternately and repeatedly stacked. Because the barrier layer 11 has alower moisture transmission rate and lower oxygen transmittance than theflexible substrate 10 that is formed of the plastic film, moisture andoxygen transmitted through the flexible substrate 10 can be suppressedfrom permeating into the display unit 20.

The buffer layer 12 is also formed of an inorganic layer, and forexample may include a silicon oxide or a silicon nitride. The bufferlayer 12 provides a flat surface for forming the pixel circuit, andsuppresses permeation of moisture and foreign particles into the pixelcircuit and the organic light emitting diode 50.

One of the barrier layer 11 or the buffer layer 12 may not be formed.

A thin film transistor 40 and a capacitor (not shown) are formed on thebuffer layer 12. The thin film transistor 40 includes a semiconductorlayer 41, a gate electrode 42, and source/drain electrodes 43 and 44.

The semiconductor layer 41 may be formed of a polysilicon or oxidesemiconductor, and includes a channel area 411 in which impurities arenot doped and a source area 412 and a drain area 413 in which impuritiesare doped. The source area 412 and the drain area 413 may be disposed atrespective sides of the channel area. When the semiconductor layer 41 isformed of the oxide semiconductor, an additional protective layer forprotecting the semiconductor layer 41 may be formed.

A gate insulating layer 13 is formed between the semiconductor layer 41and the gate electrode 42, and an interlayer insulating layer 14 isformed between the gate electrode 42 and the source/drain electrodes 43and 44. The gate insulating layer 13 and the interlayer insulating layer14 may be formed of inorganic layers.

The thin film transistor 40 shown in FIG. 2 is a driving thin filmtransistor for OLED device, and the pixel circuit may further includes aswitching thin film transistor (not shown). The switching thin filmtransistor is used as a switching element that selects a pixel for lightemission, and the driving thin film transistor applies power for lightemission to the selected pixel. The thin film transistor 40 may be aswitching thin film transistor for the liquid crystal display.

In FIG. 2, the thin film transistor 40 has a top gate structure, but thestructure of the thin film transistor 40 is not limited thereto. Inaddition, the pixel circuit may be provided with three or more thin filmtransistors and two or more capacitors.

A planarization layer 15 is formed on the source and drain electrodes 43and 44. The planarization layer 15 may be formed of an organicinsulation material or an inorganic insulation material, or may beformed of a combination of the organic insulation material and theinorganic insulation material. As the organic insulation material, anacryl-based resin, an epoxy-based resin, a phenol-based resin, apolyamide-based resin, and the like may be used. The planarization layer15 includes a via hole that exposes the drain electrode 44, and theorganic light emitting diode 50 is formed on the planarization layer 15.

The organic light emitting diode 50 includes a pixel electrode 51, anorganic emission layer 52, and a common electrode 53. The pixelelectrode 51 is formed in each pixel, and is connected with the drainelectrode 44 of the thin film transistor 40 through the via hole. Thecommon electrode 53 is formed throughout a display area DA of theflexible substrate 10. The pixel electrode 51 is surrounded by a pixeldefining layer 16 that partitions pixel areas, and the organic emissionlayer 52 is formed on the exposed pixel electrode 51.

The emission layer 52 may be one of a red emission layer, a greenemission layer, and a blue emission layer. Alternatively, the organicemission layer 52 may emit white light. The organic emission layer 52emitting the white light may be formed of a single white emission layer,or may be formed in a multi-layered structure of a red emission layer, agreen emission layer, and a blue emission layer. When the organicemission layer 52 emits the white light, a color filter (not shown) mayfurther be included in the OLED device.

One of the pixel electrode 51 and the common electrode 53 is a holeinjection electrode (i.e., anode) and the other is an electron injectionelectrode (i.e., cathode). Holes injected from the anode and electronsinjected from the cathode are combined in the organic emission layer 52to generate excitons, and light is emitted while the excitons dischargeenergy.

At least one of the hole injection layer and a hole transport layer maybe provided between the anode and the organic emission layer 52, and atleast one of the electron injection layer and an electron transportlayer may be provided between the organic emission layer 52 and thecathode. The hole injection layer, the hole transport layer, theelectron transport layer, and the electron injection layer may be formedover the entire display area DA of the flexible substrate 10.

One of the pixel electrode 51 and the common electrode 53 may be formedof a metal reflective layer and the other may be formed of asemi-transmissive or transparent conductive layer. Light emitted fromthe organic emission layer 52 is reflected by the metal reflective layerand emitted to the outside through the transparent conductive layer. Incase of the semi-transmissive layer, light emitted from the organicemission layer 52 is partially reflected to the metal reflective layeragain such that a resonance structure is formed.

The thin film encapsulation layer 30 protects the organic light emittingdiode 50 from the external environment that contains moisture and oxygento suppress deterioration of the organic light emitting diode 70 due tomoisture and oxygen. The thin film encapsulation layer 30 may be formedof a multi-layered structure in which a plurality of organic layers anda plurality of inorganic layers are alternately stacked one by one.

The plurality of organic layers of the thin film encapsulation layer 30may be formed of a polymer, for example, polyethylene terephthalate,polyimide, polycarbonate, epoxy, polyethylene, and polyacrylate. Theplurality of inorganic layer of the thin film encapsulating layer 30 maybe an oxide, a nitride or oxynitride. For example, the inorganic layermay contain any one of SiNx, Al₂O₃, S_(i)O₂, AZO, ZnO, ZrO, TiO₂ andSiON.

The flexible substrate 10 includes a display area DA where the displayunit 20 and the thin film encapsulation layer 30 are disposed, and a padarea PA at an exterior side of the thin film encapsulation layer 30. Padelectrodes (not shown) connected with the pixel circuit are disposed inthe pad area PA, and the pad electrodes are electrically connected witha chip on film 61 attached to the pad area PA or a flexible printedcircuit board. In FIG. 1, reference numeral 62 denotes an integratedcircuit chip disposed on the pad area PA.

In the flexible display device 100, an inorganic layer 19 includes atleast one of the barrier layer 11, the buffer layer 12, the gateinsulating layer 13, and the interlayer insulating layer 14, and isformed over the top surface of the flexible substrate 10. In addition,the thin film encapsulation layer 30 is not formed on a periphery of theflexible substrate 10 such that the inorganic layer 19 is exposed to theoutside of the thin film encapsulation layer 30. The thin filmencapsulation layer 30 may be disposed on an inner side of the flexiblesubstrate 10 with a gap of about 600 μm to about 700 μm from the edge ofthe flexible substrate 10.

FIG. 3 is a schematic cross-sectional view provided for description of amanufacturing method of the flexible display device.

Referring to FIG. 3, the flexible display device may be manufacturedthrough a process in which a plurality of display units 20 and aplurality of thin film encapsulation layers 30 are formed on a flexiblemother board 101, an upper protection film 65 and a lower protectionfilm 66 are attached to the flexible mother board 101, the flexiblemother board 101 is cut into individual flexible display devices bycutting between the plurality of thin film encapsulation layers 30(“Scribe Line”), and the upper protection film 65 and the lowerprotection film 66 are removed from the separated flexible displaydevices.

The upper protection film 65 and the lower protection film 66 may beformed of at least one layer of a plastic film and an adhesive layer.

When cutting the flexible mother board 101, a wheel cutting method and alaser cutting method used to cut a rigid substrate such as glass may notbe applied. In case of the wheel cutting method, the upper protectionfilm 65 and the lower protection film 66 may be torn during the cuttingprocess, and in case of the laser cutting method, the organic lightemitting diode is deteriorated due to heat from laser irradiation.Therefore, the flexible mother board 101 may be cut through a pressmethod using a cutting knife 67.

However, because a cutting force of about 5 tons to about 15 tons isdirectly applied as an impact to the flexible mother board 101, stressis concentrated to the inorganic layer 19 disposed adjacent to a cuttingline CL. In addition, because the cutting knife 67 penetrates the upperprotection film 65 and directly cuts the inorganic layer 19, and abending stress is generated from the flexible mother board 101.Accordingly, the inorganic layer 19 disposed adjacent to the cuttingline CL is damaged, thereby causing cracks.

Referring to FIG. 1 to FIG. 3, the inorganic layer 19 in the flexibledisplay device 100 according to the present exemplary embodimentincludes an opening 191 that suppresses spread of cracks into an innerside of the flexible display 100 to the thin film encapsulation film 30.The opening 191 may be provided between the edge of the flexiblesubstrate 10 and the thin film encapsulation layer 30. The opening 191prevents cracks generated during the cutting process from being spreadand transmitted to the thin film encapsulation layer 30 and the displayunit 30 in an inner side of the flexible display 10 through theinorganic layer 19.

Although the flexible display device 100 according to the presentexemplary embodiment cannot suppress generation of cracks during thecutting process, spread and transmission of the cracks toward the thinfilm encapsulation layer 30 during a post-process is suppressed by usingthe opening 191. Therefore, panel shrinkage and display failure due tospread of the cracks can be prevented.

The opening 191 of the inorganic layer 19 may be formed using a methodsuch as etching and the like. In addition, the opening 191 may extendalong a three edge of the flexible substrate 10 between the edge of theflexible substrate 10 and the thin film encapsulation layer 30 excludingone edge in which the pad area PA exists.

Pad electrodes are disposed in the pad area PA and the inorganic layer19 insulates between the pad electrodes. In the pad area PA, the opening191 is formed with a plurality of openings disposed between the padelectrodes so as to prevent spread of the cracks and at the same timeinsulate between pad electrodes. The opening 191 of the inorganic layer19 may be formed at about 100 μm to about 500 μm from the edge of theflexible display 100. In FIG. 2, a distance between the edge of theflexible display 100 and the opening 191 is denoted as d.

When the distance d between the edge of the flexible display 100 and theopening 191 is less than 100 μm, the cracks may spread over the opening191 during the cutting process, and when the distance d between the edgeof the flexible display 100 and the opening 191 exceeds 500 μm, thecracks may spread to the thin film encapsulation layer 30 through theinorganic layer included in the thin film encapsulation layer 30. Theopening 191 may have a width of about 20 μm to 200 μm.

In FIG. 2, the inorganic layer 19 includes the barrier layer 11, thebuffer layer 12, the gate insulating layer 13, and the interlayerinsulating layer 14, but the inorganic layer 19 may include only one ofthe layers or two or three of the layers.

The inorganic layer 19 according to the embodiment of the inventiveconcept may be partially removed. For example, only the interlayerinsulating layer 14, only the interlayer insulating layer 14 and thegate insulating layer 13, or only the interlayer insulating layer 14.The gate insulating layer 13 and the buffer layer may be selectivelyremoved.

As described, the flexible display 100 of the present exemplaryembodiment can prevent spread of the cracks toward the thin filmencapsulation layer 30 by forming the opening 191 in the inorganic layer19, and accordingly, panel shrinkage and display failure can besuppressed, thereby improving production yield.

FIG. 4 is a partially enlarged cross-sectional view of a flexibledisplay device according to a second exemplary embodiment.

Referring to FIG. 4, a flexible display device 200 according to thesecond exemplary embodiment is the same as the flexible display deviceof the first exemplary embodiment, except that a plurality of openings192 of an inorganic layer 19 are formed along a first direction. Thesame reference numerals are used for the same components as those of thefirst exemplary embodiment.

The first direction is a direction that faces toward a display unit 20from the edge of a flexible substrate 10.

Each opening 192 is formed at a different distance from the edge of theflexible substrate 10. In FIG. 4, three openings 192 are formed, but thenumber of openings 192 is not limited thereto.

Because the plurality of openings 192 are formed along a crack spreadpath in the second exemplary embodiment, the spread of the cracks can beblocked more efficiently.

FIG. 5A is a partially enlarged cross-sectional view of a flexibledisplay device according to a third exemplary embodiment, and FIG. 5B isa top plan view of FIG. 5A.

Referring to FIG. 5A and FIG. 5B, a flexible display device 300according to the third exemplary embodiment is the same as the flexibledisplay device of the first exemplary embodiment, except that aplurality of openings 193 are formed along a second direction. The samereference numerals are used for the same components as those of thefirst exemplary embodiment.

The second direction is a direction that is parallel with the edge of aflexible substrate 10. A width w of each of the plurality of openings193 is greater than a distance d between the openings 193. Therefore,the area of the inorganic layer 19 occupying along a crack spreaddirection toward the display unit 20 from the edge of the flexiblesubstrate 10 can be significantly reduced, and accordingly the spread ofcracks through the inorganic layer 19 can be suppressed.

FIG. 6A is a partial top plan view of a flexible display deviceaccording to a fourth exemplary embodiment.

Referring to FIG. 6A, a flexible display device 400 according to thefourth exemplary embodiment is the same as the flexible display deviceof the first exemplary embodiment, except that a plurality of openings194 are formed along first and second directions of an inorganic layer19. The same reference numerals are used for the same components asthose of the first exemplary embodiment.

The first direction is a direction that faces toward a display unit fromthe edge of a flexible substrate, and the second direction is adirection that is parallel with the edge of the flexible substrate. Adistance d1 between the openings 194 along the first direction isgreater than a distance d2 between the openings 194 along the seconddirection. In this case, spread cracks of the inorganic layer 19 can beintroduced to a direction where the openings 194 have narrow distances,that is, the second direction, and accordingly the spread of the cracksin the first direction can be suppressed.

In FIG. 6A, each opening 194 is formed in the shape of a rectangularshape or an oval shape that extends in the second direction, but theshapes of the openings are not limited thereto. The openings may bearranged to form at least two rows extending along the second directionas shown in FIG. 6B. Gaps between the openings 194 in a first row and asecond row may not be in a same line extending substantiallyperpendicular to the edges of the flexible substrate. Thus, the gaps inthe first row are covered by the openings in the second row. Thus, thecrack generated during the cutting process is prevented from spread intothe inner side of the flexible display 100 to the thin filmencapsulation film 30.

FIG. 7 is a partially enlarged cross-sectional view of a flexibledisplay device according to a fifth exemplary embodiment.

Referring to FIG. 7, a flexible display device 500 according to thefifth exemplary embodiment is the same as the flexible display devicesof the first to fourth exemplary embodiments, except that a blockinglayer 195 is formed by filling an organic material in an opening of aninorganic layer 19.

The blocking layer 195 may include at least one of a urethane-basedresin, an epoxy-based resin, and an acryl-based resin. Like theabove-stated opening, the blocking layer 195 prevents spread andtransmission of cracks generated from the edge of the inorganic layer 19during a cutting process toward a thin film encapsulation layer 30.

The inorganic layers 19 of the second exemplary embodiment to the fifthexemplary embodiment may respectively include barrier layers 11, bufferlayers 12, gate insulating layers 13, and interlayer insulating layers14, or may respectively include only one of the layers, or may includetwo or three of the layers.

While this inventive concept has been described in connection with whatis presently considered to be practical exemplary embodiments, it is tobe understood that the inventive concept is not limited to the disclosedembodiments, but, on the contrary, is intended to cover variousmodifications and equivalent arrangements included within the spirit andscope of the appended claims.

What is claimed is:
 1. A flexible display device comprising: a flexiblesubstrate including a display area and a periphery surrounding thedisplay area; an inorganic layer formed on the flexible substrate; adisplay unit formed on the display area; and a thin film encapsulationlayer covering the display unit, wherein the inorganic layer includes anopening disposed on a periphery between edges of the flexible substrateand the thin film encapsulation layer.
 2. The flexible display device ofclaim 1, wherein the inorganic layer comprises at least one of a barrierlayer, a buffer layer, a gate insulating layer, and an interlayerinsulating layer.
 3. The flexible display device of claim 2, wherein theopening extends along the edges of the flexible substrate.
 4. Theflexible display device of claim 3, wherein the opening in which a padarea exists includes a plurality of opening patterns disposed betweenpad electrodes.
 5. The flexible display device of claim 4, wherein ablocking layer is formed by filling an organic material in the opening,the organic material comprising at least one of a urethane-based resin,an epoxy-based resin, and an acryl-based resin.
 6. The flexible displaydevice of claim 3, wherein the opening is formed at about 100 μm to 500μm from the edge of the flexible display.
 7. The flexible display deviceof claim 6, wherein a width of the opening is about 20 μm to about 200μm.
 8. The flexible display device of claim 7, wherein a blocking layeris formed by filling an organic material in the opening, the organicmaterial comprising at least one of a urethane-based resin, anepoxy-based resin, and an acryl-based resin.
 9. The flexible displaydevice of claim 3, wherein the opening includes a plurality of openingsextending along a second direction and substantially parallel to eachother.
 10. The flexible display device of any one of claim 9, wherein ablocking layer is formed by filling an organic material in the opening,the organic material comprising at least one of a urethane-based resin,an epoxy-based resin, and an acryl-based resin.
 11. The flexible displaydevice of claim 3, wherein the opening includes a plurality of openingsarranged along a second direction that is parallel with the edges of theflexible substrate.
 12. The flexible display device of any one of claim11, wherein a blocking layer is formed by filling an organic material inthe opening, the organic material comprising at least one of aurethane-based resin, an epoxy-based resin, and an acryl-based resin.13. The flexible display device of claim 11, wherein the plurality ofopenings are arranged to form at least two rows arranged along thesecond direction, and gaps between the openings in a first row and asecond row are not in a same line substantially perpendicular to theedges of the flexible substrate.
 14. The flexible display device ofclaim 13, wherein the gaps between the openings in a first row and asecond row is smaller than a gap between the openings in a first row andthe second row.
 15. The flexible display device of any one of claim 14,wherein a blocking layer is formed by filling an organic material in theopening, the organic material comprising at least one of aurethane-based resin, an epoxy-based resin, and an acryl-based resin.16. The flexible display device of claim 3, wherein the inorganic layerincludes a plurality of openings disposed along a second direction. 17.The flexible display device of claim 16, wherein the width of each ofthe plurality of openings along the second direction is greater than adistance between the plurality of openings.
 18. The flexible displaydevice of claim 17, wherein a blocking layer is formed by filling anorganic material in the opening, the organic material comprising atleast one of a urethane-based resin, an epoxy-based resin, and anacryl-based resin.
 19. The flexible display device of any one of claim2, wherein a blocking layer is formed by filling an organic material inthe opening, the organic material comprising at least one of aurethane-based resin, an epoxy-based resin, and an acryl-based resin.20. The flexible display device of any one of claim 1, wherein ablocking layer is formed by filling an organic material in the opening,the organic material comprising at least one of a urethane-based resin,an epoxy-based resin, and an acryl-based resin.